Relevant Materials

Which Material for Which Function

WCu

Tungsten-Copper

Combines the thermal conductivity of copper with an expansion coefficient matched to chips and ceramics: heat sinks and contacts without thermomechanical stress.

MoCu

Molybdenum-Copper

Lighter than tungsten-copper with a similarly matched CTE: heat spreaders for power semiconductors (IGBT, SiC).

W

Tungsten

High resistance to arc erosion: switching and welding contacts.

Mo

Molybdenum

Good electrical conductivity combined with high temperature resistance: electrode material.

Ta

Tantalum

High capacitance per unit volume: electrolytic capacitors in power electronics and charging infrastructure.

Application Examples

Components in Everyday Use

  • Heat sinks under IGBT and SiC modules
  • Heat spreaders in inverter assemblies
  • Switching contacts in relays and contactors
  • Welding contacts in battery manufacturing
  • Tantalum electrolytic capacitors in chargers

Why Refracore. W-Cu and Mo-Cu are our specialty — we supply standard formats on short lead times via wolframkupfer.de, and custom mixing ratios plus CNC machining to drawing via Refracore. We advise on which conductivity-to-CTE ratio fits your chip or substrate combination.

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Tungsten-copper square bar stock